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1.High-performance soldering flux, fast melting speed, good fluidity and quick speed to coat with tin.
2.Lower soldering flux spatter rate during soldering.
3.Soldering flux is evenly distribution with good continuity.
4.Very little smoke and smell gas.
5.Inhibit the cracking of solder joints, copper corrosion and the growth of interface alloy layer.
6.Little residue, no corrosion, high insulation resistance and no-clean solder wire.